MVsilicon BP1064

## MVsilicon BP1064 Chip Introduction

**BP1064** is a highly integrated 32-bit Bluetooth audio application processor from MVsilicon Integrated Circuits, suitable for Bluetooth speakers, karaoke devices,

USB sound cards, soundbars, and other audio products.

### Core Specifications

Category & Parameters

Core:32-bit RISC, up to 288MHz, supports DSP instructions and FPU

Bluetooth:Dual-mode V5.0, supports A2DP, AVRCP, HFP, etc., with Packet Loss Concealment (PLC)

Audio Performance:ADC SNR ≥94dB / DAC SNR ≥105dB

Audio Interfaces:4x 16bit ADC, 3x 24bit DAC (direct headphone drive), 2x I2S, 1x S/PDIF

Other Interfaces:USB 2.0 Full Speed (OTG), UART, I2C, SPI, PWM, GPIO

Storage:Built-in 16Mbit Flash, 320KB SRAM

Package:LQFP-48 / LQFP-64

### Key Features

1. **High-Performance Audio Processing**

   - Built-in **FFT accelerator**, suitable for efficient processing of complex audio algorithms

   - Supports multiple audio format encoding/decoding (MP3, AAC, FLAC, WAV, etc.)

2. **Rich Audio Effects Algorithms**

   - Acoustic Echo Cancellation (AEC)

   - Reverb, 3D surround

   - Anti-howling, voice changer, EQ equalizer

3. **Flexible Connectivity Options**

   - Bluetooth 5.0 wireless connection

   - USB 2.0 wired connection, suitable for USB microphones or USB sound cards

4. **Comprehensive Development Support**

   - Based on Eclipse IDE + GCC compiler

   - Supports FreeRTOS operating system

   - Provides complete SDK and audio algorithm middleware

### Typical Application Scenarios

- **Portable karaoke devices (karaoke microphones)**: Built-in reverb, anti-howling, microphone input

- **USB microphone / USB sound card**: Supports USB OTG, plug-and-play

- **Wireless Bluetooth speakers**: Bluetooth 5.0 + integrated DAC for simple design

- **Soundbars**: S/PDIF interface supports HDMI audio and ARC

- **DIY audio projects**: Digital crossover, DSP tuning as pre-processing stage

### Chip Model Variants

The BP1064 series includes several specific models, such as **BP1064A2** and **BP1064L2**. The main differences lie in package form and some peripheral configurations.

The appropriate model can be selected based on actual product requirements.